Cutting Tools
Horn Tool Configurator Shortens Lead Times
The HTC system enables quotations to be generated within one working day, with technical drawings available the next working day.
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Kyocera Precision Tools' Coated Carbide Optimizes Turning
The CA115P/CA125 series is designed to provide extended tool life and superior performance in a variety of machining scenarios.
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Big Daishowa Enhances Boring Tools With Vibration Damping
Smart Damper technology shortens the distance from the damping mechanism to the cutting edge, which is the source of vibration.
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Precision Machining Technology Review October 2023
Production Machining’s October 2023 technology showcase includes some of the latest technology from Tungaloy-NTK America Inc., Renishaw, Walter USA, Seco Tools and Haimer USA.
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Tungaloy Grooving Toolholders Provide Stable Turning
TungHeavyGroove includes an enhanced insert clamping design for maximum tool rigidity.
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Seco Tooling Lineup Promotes Optimized Part Processing
The company’s expanded tooling lineup is aimed at applications ranging from general ISO turning to high-volume hard turning and deep-hole drilling.
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Boring Head Enables Sculpture Hardware to Be Machined on a Lathe
When small job shop Ansonia Manufacturing took on a tricky hardware component job for a “live” glass art sculpture, it realized a boring head would be needed to machine the part complete on its live-tool lathe.
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Walter Turning Grades Reduce Machining Times
The WKP01G and WPP05G grades are ideal for continuous cutting and occasional interrupted cuts in high-tensile materials.
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What Is Trochoidal Turning? How Might Shops Benefit From It?
While trochoidal milling might be a more well-known toolpath strategy, trochoidal turning can offer similar benefits such as high material removal rates especially for rough-turning operations.
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Tungaloy-NTK PCD Grade Offers Optimal Dimensional Accuracy
The DX200 is an effective tool for machining application-specific components that demand high levels of material purity, such as metal medical implants and sputtering targets for semiconductor applications.
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